Entice Waves
Entice Waves

The Future of Satellite Communications

The Future of Satellite Communications The Future of Satellite Communications The Future of Satellite Communications

ENTICE develops millimetre-wave RF technology that enables smaller, lighter and higher-performance satellite communications

The Future of Satellite Communications

The Future of Satellite Communications The Future of Satellite Communications The Future of Satellite Communications

ENTICE develops millimetre-wave RF technology that enables smaller, lighter and higher-performance satellite communications

About ENTICE

Our Mission

Our Technology

Our Technology

At ENTICE, our mission is to move the satellite communications industry forward to a more efficient, cheaper and scalable future.

Our Technology

Our Technology

Our Technology

 ENTICE has developed a patented resonator architecture that enables compact, high performance RF components for next-generation satellite communications. 

Our Team

Our Technology

Our Team

Our team is made up of experienced RF scientists and researchers, with decades of experience in the industry and Academia.

A New Approach

 Satellite communications are moving to higher frequencies, but current RF hardware forces trade-offs between size, performance and cost. Existing solutions are either bulky, lossy or expensive.


At ENTICE, we have created a fundamentally new approach designed to combat these trade-offs and move to a compact, scalable and cheaper future.

Technology

Resonators

Our new resonator design allows for a 10x size reduction,  high performance at sub 20Ghz and scalable lithography fabrication while being less sensitive to minor manufacturing mistakes and imperfections.

Filtennas

 Our filtenna technology combines filtering and antenna functionality into a single compact device, reducing size, insertion losses and overall system complexity while maintaining high RF performance. 

Filtenna Arrays

Our technology is not just a single device, but rather a platform technology that can be applied to various other devices. These include: antenna arrays, couplers and more.

Manufacturing Process

(1) Development

Photoresist is applied to the wafer and spun until uniform.

Desired features to be developed utilising greyscale masks.

(2) Metalisation

The wafer is entirely metalised with an exceptionally thin yet uniform layer of silver.

(3) Assembly

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Finished Product

Patented Tech

Patents

Split distributed resonator architecture.

PCB-fed split concentric ring resonator and filter.

IP assets

Design libraries

Fabrication knowledge and experience

Lithographic manufacturing process

Internal Knowledge

Process Expertise

Integration knowledge and experience

Roadmap

2026

2026

2026

 

  • Process Refinement
  • Product Qualification
  • Pilot Customers

2027

2026

2026

 

  • Continued product refinement
  • Initial Product launch with pilot customers

2028

2026

2028

 

  • Manufacturing scale-up​
  • External validation​
  • Multi-customer revenue expansion

Contact Us

Inquiries? Let us know down below.

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